Solutions for maximum reliability
Fraunhofer Institute for Mechanics of Materials IWM
© Fraunhofer IWM
Processes and designs that you can count on - reliable systems
One expects a new technical device that has just been bought to work faultlessly and fulfill the functions that were paid for. Equally, when a company introduces a new manufacturing process, one expects it to run reliably and produce components to the required quality.
Behind every reliable component is a clear understanding of how the properties of the materials change or are affected during component manufacture. We can help you understand through:
Thermal defect localization
It is important to localize defects with electrical effects on a chip and its components in order to perform physical defect analysis. One needs processes that can localize the defects within the component with a high degree of sensitivity and precision on a micrometer scale. When subjected to a current, short circuit defects or high resistance connection defects cause localized heating that help identify the defective area. Together with the Max-Planck Institute for Microstructure Physics in Halle, we have developed a special method of lock-in thermography with which to electrically stimulate the defective circuit and create an image of the component with a high-resolution thermo-camera. Current research work is focused on the localization of defects in ICs, MEMS and in encapsulated complex multichip components (SiP).
Localization of stray gate current in integrated circuits via lock-in thermography. (PDF)
Understanding technical damage
Improving quality and optimizing processes is crucial in all branches of industry. Problems can always arise in any manufacturing process and have a negative effect on the quality of individual components or even of a whole series of products. Comprehensive damage analysis involves the damage analysis and evaluation via chemical analyses, grain evaluation, the determination of characteristics relevant to strength and fracture surface analysis as well as an examination of the entire process in terms of abnormalities and deviations. This makes it possible to both suggest how to avoid the damage from occurring again and to flag up the necessary process optimizations. In the case of a dispute, a specialist survey is carried out by an official, impartial expert and the technical responsibilities are resolved.
Damage and microstructural analyses as the starting point for technical optimization. (PDF)
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