Microtribology

Fraunhofer Institute for Mechanics of Materials IWM

Rasterkraftmikrosopie-Aufnahme einer tribologisch belasteten Aluminium-Zylinderlaufbahn© Fraunhofer IWM

The causes of tribological problems can be found at various levels - from the nano to the micro or the macro scale. Molecular interactions at the atomic level characterize, for instance, the behavior of a lubricant in combination with a specific surface. Mesoscopic effects, such as the effects of the microstructure, roughness and surface strength, are equally important.

In order to understand wear mechanisms, we take a damage mechanics and energy-based approach as well continuous, high-resolution friction and wear measurements. We identify the effects of tribological loads close to the material surface, e.g. during final processing or running-in, with the aid of surface physics and surface chemistry methods. One of the group’s focal points is sport tribology - the group develops, for example, coatings for skis and optimizes the runners on sporting equipment.

Services

  • Continuous friction and wear analysis for automotive components
  • Mechanochemistry for the development of wear protection additives
  • Fundamental tribology research
  • Tribology in competitive sports
  • Nano-wear of coatings, e.g. diamond-like carbon layers

Publications

      

Publications of group Microtribology

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2012

  • Korres, S.; Feser, T.; Dienwiebel, M., In situ observation of wear particle formation on lubricated sliding surfaces, Acta Materialia 60 (2012) 420-429; 271/2012

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2011

  • Gebeshuber, I.C.; Drack, M.; Scherge, M., Tribology in biology, accepted Tribology, 2(2008)4, 200-212
  • Dienwiebel, M.; Pöhlmann, K.; Scherge, M.,Origins of the wear resistance of AlSi cylinder bore surfaces studied by surface analytical tools, Tribology International, 40(2007)10-12, 1597-1602
  • Opitz, A.; Scherge, M.; Ahmed, S. I.-U.; Schaefer, J. A., A comparative investigation of thickness measurements of ultra-thin water films by scanning probe technique, J. Appl. Phys., 101(2007), 064310
  • Shakhvorostov, D.; Gleising, B.; Büscher, R.; Dudzinsky, W.; Fischer, A.; Scherge, M., Microstructure of tribologically induced nanolayers produced under ultra-low wear rates, angenommen durch:, Wear, 263(2007), 1259-1265

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2010

  • Ditroi, F.; Takacs, S.; Tarkanyi, F.; Reichel, M.; Scherge, M.; Gerve, A.,Thin layer activation of large areas for wear study, Wear, 261(2006), 1397-1400
  • Liu, Y.; Gubisch, M.; Hild, W.; Scherge, M.;. Schaefer, J.A., Nanoscale Multilayer WC/C Coatings Developed for Nanopositioning. Part II: Friction and wear, Thin Solid Films, 488 (2005)1-2, 140-148
  • Opitz, A.; Ahmed, S. I.-U.; Scherge, M.; Schaefer, J. A., Nanofriction mechanisms derived from the dependence of friction on load and sliding velocity from air to UHV on hydrophilic silicon Tribology Letters, 20(2005)3, 237-242

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2009

  • Shakhvorostov, D.; Pöhlmann, K.; Scherge, M., An energetic approach to friction, wear and temperature Wear, 257(2004)1-2, 124-130
  • Shakhvorostov, D.; Pöhlmann, K.; Scherge, M., Structure and mechanical properties of tribologically induced nanolayers, Wear, 260(2004)1-2, 433-437
  • Scherge, M.; Martin, J. M.; Pöhlmann, K.; Characterization of wear debris of systems operated under low wear-rate conditions, Wear, 260(2004)1-2, 458-461

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2008

  • Hild, W.; Schaefer, J. A.; Scherge, M., The effect of wetting on the microhydrodynamics of surfaces lubricated with water and oil, Wear, 254(2003), 871-875
  • Opitz, A.; Ahmed, S. I.-U.; Schaefer, J. A .; Scherge, M., Friction of silicon oxide covered with thin water film, Wear, 254(2003), 924-929
  • Scherge, M.; Chakhvorostov, D.; Pöhlmann, K., Fundamental wear mechanisms of metals Wear, 255/1-6(2003), 395-400
  • Scherge, M.; Pöhlmann, K.; Gerve, A., Wear Measurement using Radio-Nuclide-Technique (RNT) Wear, 254(2003), 801-818

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2007

  • Gorb, S. N.; Beutel, R. G.; Gorb, E.; V.; Jiao, Y.; Kastner, V.; Niederegger, S.; Popov, V.L.;:Scherge, M.; Schwarz, U.;Vötsch, W.,Structural Design and Biomechanics of Friction-Based Releasable Attachement Devices in Insects, Integrative and Comparative Biology, 42(2002)6, 1127-1139
  • Nevshupa, R.A.; Scherge, M.; Ahmed, S.I.-U., Transitional friction behavior of hydrophilic silicon induced by spontaneous water adsorption, Surface Science, 517(2002)1-3, 17-28
  • Opitz, A.; Ahmed, S. I.; Schaefer, J. A.; Scherge, M., Friction in thin water films: A nanotribological study, Surface Science, 504 (C)(2002), 199-207
  • Scherge, M.; Schaefer, J. A., Macro and Microtribology – Similar Results, Different Origins?, TriboTest, 7(2001), 245-253

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2006

  • Gorb, S. N.; Jiao, Y.; Scherge, M., Ultrastructural architecture and mechanical properties of attachment pads in Tettigonia viridissima, Journ. of Comparative Physiology A, 186(2000), 821-831
  • Gorb, S. N.; Scherge, M., Biological microtribology: Anisotropy in frictional forces of orthopteran attachment pads reflects ultrastructure of highly-deformable material Proc. Royal Soc., 267(2000)1449, 1239-1244
  • Jiao, Y.; Scherge, M.; Gorb, S. N., Adhesion measured on the attachment pads of the Tettigonia viridissima (Orthoptera, Insecta), Journ. of Exp. Biol., 203(2000)12, 1887-1895.
  • Liu, H.; Ahmed, S. I.; Scherge, M., Microtribological properties of silicon and silicon coated with diamond like carbon, oxtadecyltrichlorosilane and stearic acid cadmium salt films: a comparative study, Thin Solid Films, 381(2000)1, 135-142
  • Scherge, M.; Gorb, S. N., Using Biology to Design MEMS, J. of Micromech. Microeng. 10(2000)1449, 359-364
  • Scherge, M.; Gorb, S. N., Microtribology of Bio-Substrates, Tribology Letters, 8(2000), 1-7
  • Scherge, M.; Li, X.; Schaefer, J. A., The effect of water on friction of MEMS, Tribology Letters, 6(1999)3-4, 215-220
  • Scherge, M.; Schaefer, J. A.; Mollenhauer, O.; Spiller, F., Micromechanical Thin-Film Characterization MRS Symp. Proc., 569(1999), 139

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2005

  • Klotzbücher, T.; Scherge, M.; Mergens, M.; Wesner, D. A.; Kreutz, E. W., Deposition of Carbon Nitride Thin Films in a Hybrid RF-PLD-Technique, Surf. and Coat. Techn., 98(1998)1-3
  • Scherge, M.; Büchner, H.; Jäger, G.; Schaefer, J. A., Interferometric detection of adhesion induced nano-deflections, Journal of Optics, 29(1998), 1-5
  • Scherge, M.; Li, X.; Schaefer, J. A., Nanotribological Improvements due to Surface Chemistry Modification, MRS Symp. Proc., 522(1998), 481-486
  • Scherge, M.; Schaefer, J. A., Surface Modification and Mechanical Properties of Bulk Silicon, in: Tribology Issues and Opportunities in MEMS, Kluwer Academic Publishers, 1998, 529-538
  • Scherge, M.; Schaefer, J. A., Microtribological Investigations of Stick/Slip Phenomena using a novel Oscillatory Friction and Adhesion Tester, Tribology Letters, 4(1998)1, 37-42

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2004

  • Bauer, C. L., Scherge, M.; Mullins, W. W., Field-Induced Evolution of Surface Topography in Polycrystalline Thin Films, Materials Science Forum, 207-209(1996), Part 2
  • Gatzen, H. H.; Ma, X.; Scherge, M.; Jhon, M. S.;. Bauer, C. L., Observations Regarding the Tribological Properties of SiC and Altic Sliders, IEEE Transaction on Magnetics, 32(1996)5, 3783-3785
  • Sui, X.; Scherge, M.; Kryder, M. H.; Snyder, J. E.; Harris, V. G.; Koon, N. C., Barium Hexaferrite Thin Film Recording Media, Journal of Magnetism and Magnetic Materials, 155(1996)1-3

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2003

  • Scherge, M.; Bauer, C. L.; Mullins, W. W., Stress Distribution and Mass Transport along Grain Boundaries during Steady-State-Electromigration, Acta Metallurgica et Materialia, 43(1995)9
  • Scherge, M.; Sui, X.; Bauer, C. L.; Jhon, M. S.; Kryder, M. H., Tribological Properties of Barium Ferrite Films, IEEE Transaction on Magnetics, 31(1995)6, 2928-2930
  • Zou, P.; Scherge, M.; Lambeth, D., Tribological Characterization of Carbon Nitride Hard Disk Overcoat at Quasi-Contact Operating Conditions, IEEE Transaction on Magnetics, 31(1995)6, 2985-2987
  • Scherge, M., Electromigration - Simulation and Experiment, AIP Conference Proceedings, 305(1993)
  • Scherge, M., The Simulation of the Ion Movement in Thin Metal Films, Modeling, Measurement and Control, 45(1992)3
  • Scherge, M.; Breternitz, V.;Knedlik, Ch., Electromigration Behaviour in Al metallizations of integrated circuits, Microelectronics and Reliability, 32(1992)1/2, 21-24

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