Machining and severing technologies

Fraunhofer Institute for Mechanics of Materials IWM

© Fraunhofer IWM

We develop and optimize low-loss and low-damage processes for solar cell production - from ingot processing via wire sawing, cell production, Verschaltung to module integration. We are specialists on the topic of brittle materials and can design the ideal machining process: near net and low damage for semi-conductor materials (e.g. silicon) and even loss-free for inorganic glasses. We also investigate the effects of damage on material strength and carry out damage analyses.

Services

  • Development of low-damage machining and separating techniques for the manufacture of glass and silicon components with high quality edges and surfaces.
  • Increased material yield in solar cell and module production.
  • Ensuring that components made from brittle fracturing materials are safe for use.
  • Damage analyses to optimize production and quality assurance.