Machining and severing technologies
Fraunhofer Institute for Mechanics of Materials IWM
We develop and optimize low-loss and low-damage processes for solar cell production - from ingot processing via wire sawing, cell production, Verschaltung to module integration. We are specialists on the topic of brittle materials and can design the ideal machining process: near net and low damage for semi-conductor materials (e.g. silicon) and even loss-free for inorganic glasses. We also investigate the effects of damage on material strength and carry out damage analyses.
- Development of low-damage machining and separating techniques for the manufacture of glass and silicon components with high quality edges and surfaces.
- Increased material yield in solar cell and module production.
- Ensuring that components made from brittle fracturing materials are safe for use.
- Damage analyses to optimize production and quality assurance.