Diagnostic of semiconductor technologies

Fraunhofer Institute for Mechanics of Materials IWM

© Fraunhofer IWM

High-resolution material diagnostics and physical defect analysis is used to help manufacturers of microelectronic components introduce new process technologies and assure a high production quality. Our work is focused on the analysis of material interactions in relation to process parameters and operational conditions. This enables us to identify the causes of defective processing and faulty electrical behavior. We develop the diagnostic techniques needed to localize and analyze electrical defects and internal stresses in new processes or improve on existing processes.

Services

  • Process characterization and structural evaluation.
  • Physical defect analysis in microelectronic components.
  • Analysis of other designs.
  • Circuit modifications.
  • Localization of electrical defects on the wafer and component level.
  • Preparation development using focused ion beam technology (FIB)
  • High-resolution microstructure analysis via electron and ion microscopy.
  • Space-resolved internal stress analysis via electron and photo-optical techniques.