Characterization of microsystems

Fraunhofer Institute for Mechanics of Materials IWM

© Fraunhofer IWM

With the aid of specialist testing techniques, simulations of operational behavior and microstructure analysis processes, we characterize the operational behavior of microsystems sensors and actuators. The focus lies on silicon technology micromechanical sensors (MEMS) and gas sensors. We evaluate and model strength and lifetimes for processed MEMS components, wafers and chips and the wafer bond process used to build up complex systems. We also analyze the causes of failure and develop appropriate testing methods.

Services

  • Experimental identification, fracture mechanics evaluation and theoretical description of the deformation, strength and lifetime of sensors and actuators in silicon micromechanics on the semi-conductor level.
  • Measurement and parameter identification in Si microsystems for development and quality assurance on the wafer level, development of testing techniques and error analysis.
  • Evaluation of the quality of joins and the strength and reliability of wafer bond technologies.
  • Evaluation of the strength of thin semi-conductor chips and wafers in correlation with processing quality and operational behavior.
  • Space-resolved internal stress analysis, evaluation of the relaxation of strained Si components.
  • Error analysis of chip fractures in encapsulated components under operational conditions.
  • Assistance in designing gas analysis IR sensors.
  • Mechanical testing and lifetime analysis of stressed micro-components in ultra-precise production, e.g. micro-tools, and microscopic and nanoscopic components.